LED lamp module and fabrication method thereof

Details LED lamp module and fabrication method thereof LED lamp module and fabrication method thereof

2009-05-27

2011-12-06

Dickey, Thomas L (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257SE21499, C362S294000

Reexamination Certificate

active

08072063

ABSTRACT:
An LED lamp module includes a heat sink element having one-piece form; a circuit substrate affixed onto the heat sink element, wherein the substrate has at least an opening exposing the heat sink element, and has an area smaller than that of the heat sink element; a plurality of LED chips mounted on the exposed portion of the heat sink element and electrically connected to the circuit substrate; and a light transparent package material, encapsulating the plurality of LED chips, wherein the heat sink element includes a uniform temperature plate or a plate including at least a vacuum cavity, and an extension part extending laterally from the plate and turned to surround the plurality of LED chips, forming a secondary optical structure. A fabrication method for the LED lamp module is also disclosed. Existing fabrication process is simplified and the cost is lowered with increased heat dissipation effect.

REFERENCES:
patent: 7196354 (2007-03-01), Erchak et al.
patent: 2001/0030866 (2001-10-01), Hochstein
patent: 2005/0023551 (2005-02-01), Mizuyoshi
patent: 2005/0152146 (2005-07-01), Owen et al.
patent: 2006/0035511 (2006-02-01), Mrakovich et al.

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