Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Mesa structure
Reexamination Certificate
2003-12-15
2008-07-15
Louie, Wai-Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
Mesa structure
C257S675000, C257S712000, C257S719000, C257SE33075
Reexamination Certificate
active
07400029
ABSTRACT:
The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer12made of diamond is provided on a substrate11, and on top of this, a conductive layer13having a predetermined pattern is formed. LED chips16are mounted in predetermined positions on the conductive layer13. Terminals of the conductive layer13and electrodes of the LED chips16are connected to each other. A connector part14for the connection to a socket is provided in an end portion of the substrate11. The heat conducting layer12on the connector part14makes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chips16through the conductive layer13from the socket, and respective LED chips16emit light. Heat that is generated in the LED chips16is released to the outside of the illumination system from the socket through the conductive layer13, the heat conducting layer12and the connector part14. As a result of this, an increase in the temperature of the LED chips16can be prevented, and an LED illumination system that emits a large amount of light can be formed.
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Kawakami Yoichi
Shimada Jun'ichi
Louie Wai-Sing
Oliff & Berridg,e PLC
Yanchers Inc.
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