Illumination – Plural light sources – With support
Reexamination Certificate
2007-01-31
2009-08-11
Tso, Laura (Department: 2875)
Illumination
Plural light sources
With support
C362S800000
Reexamination Certificate
active
07572031
ABSTRACT:
An illumination assembly includes a compliant substrate comprising a first and second electrically conductive foil separated by an electrically insulating layer. The insulating layer includes a polymer material loaded with particles that enhance thermal conductivity of the insulating layer. A plurality of LED dies are disposed on the first conductive foil.
REFERENCES:
patent: 5986400 (1999-11-01), Staring et al.
patent: 6274224 (2001-08-01), O'Bryan et al.
patent: 6577492 (2003-06-01), O'Bryan, Jr.
patent: 6638378 (2003-10-01), O'Bryan et al.
patent: 6657297 (2003-12-01), Jewram et al.
patent: 6799902 (2004-10-01), Anderson et al.
patent: 2001/0012707 (2001-08-01), Shimizu et al.
patent: 2002/0113244 (2002-08-01), Barnett et al.
patent: 2003/0001488 (2003-01-01), Sundahl
patent: 2003/0063465 (2003-04-01), McMillan et al.
patent: 2003/0153099 (2003-08-01), Jiang et al.
patent: 2005/0116235 (2005-06-01), Schultz et al.
patent: 2005/0265029 (2005-12-01), Epstein et al.
patent: 2006/0012991 (2006-01-01), Weaver, Jr. et al.
patent: 2006/0098438 (2006-05-01), Ouderkirk et al.
patent: 2 662 896 (1991-06-01), None
patent: WO 2005/099323 (2005-10-01), None
Peiffer, Joel S., “Embedded Capacitor Material Evaluation”, Presented at IPC SMEMA Council APEXSM, www.GoApex.org, pp. 1-4, 2001.
Peiffer, Joel S., “Ultra-Thin, Loaded Epoxy Materials for Use as Embedded Capacitor Layers”, Thin Laminates, Printed Circuit Design & Manufacture, pp. 40-42, Apr. 2004.
Peiffer, Joel S., “The History of Embedded Distributed Capacitance”, Embedded Capacitance Patents, Printed Circuit Design & Manufacture, pp. 32-37, Aug. 2004.
Peiffer et al., “Electrical Performance Advantages of Ultra-Thin Dielectric Materials Used for Power-Ground Cores in High Speed, Multilayer Printed Circuit Boards”, http://multimedia.mmm.com/mws/mediawebserver.dyn?FFFFFFoMYRUF&i2Fsi2FFFdmNqBeeeeD-, Previously presented at IPC Expo 2003.
Xu et al., “Power-Bus Decoupling With Embedded Capacitance in Printed Circuit Board Design”, IEEE Transactions on Electromagnetic Compatibility, vol. 45, No. 1, Feb. 2003.
Murray Cameron T.
O'Bryan Nelson B.
Ouderkirk Andrew J
Peiffer Joel S.
Schultz John C.
3M Innovative Properties Company
Tso Laura
Vietzke Lance L.
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