Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Making emissive array
Patent
1996-08-19
1998-07-14
Dutton, Brian
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Making emissive array
438 26, H01L 2100
Patent
active
057803218
ABSTRACT:
A light emitting diode display package and method of fabricating a light emitting diode (LED) display package including a light emitting diode array on a substrate, having row and column connection pads routed to display connection pads positioned on an uppermost surface of the LED array device, a separate silicon driver device having connection pads routed to an uppermost surface, positioned to cooperatively meet those of the LED device when properly registered, the LED device flip chip bump bonded to the driver device using standard C5 DCA, an underfill layer positioned between the space defined by the LED device and the driver device. The LED display and driver device package subsequently having selectively removed the substrate onto which the LED array was initially formed. The light emitted from the LED display device, being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer of the LED device.
REFERENCES:
patent: 4661192 (1987-04-01), McShane
patent: 5037780 (1991-08-01), Fujimoto et al.
patent: 5385632 (1995-01-01), Goossen
Holm Paige M.
Lee Hsing-Chung
Shieh Chan-Long
Dutton Brian
Motorola Inc.
Parsons Eugene A.
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