LED chip thermal management and fabrication methods

Details LED chip thermal management and fabrication methods LED chip thermal management and fabrication methods

2007-11-19

2010-12-07

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S024000, C257S079000, C257S080000, C257SE33001

Reexamination Certificate

active

07846751

ABSTRACT:
The present invention relates to a method of fabricating a high power light-emitting device using an electrolessly or electrolytically plated metal composite heat dissipation substrate having a high thermal conductivity and a thermal expansion coefficient matching with the device.

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