LED chip package structure with high-efficiency...

Details LED chip package structure with high-efficiency... LED chip package structure with high-efficiency...

2011-05-31

2011-05-31

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S028000, C438S029000, C438S034000, C257SE25032

Reexamination Certificate

active

07951621

ABSTRACT:
An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips. Each package colloid has a colloid cambered surface and a colloid light-emitting surface respectively formed on a top surface and a front surface thereof.

REFERENCES:
patent: 6921926 (2005-07-01), Hsu
patent: 2006/0138436 (2006-06-01), Chen et al.
patent: 2006/0157724 (2006-07-01), Fujita

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