LED chip package structure with high-efficiency...

Details LED chip package structure with high-efficiency... LED chip package structure with high-efficiency...

2011-04-12

2011-04-12

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S088000, C257S090000, C257S091000, C257S098000, C257SE21499, C257SE33057, C257SE33066, C438S026000, C438S027000, C438S028000

Reexamination Certificate

active

07923745

ABSTRACT:
An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips.

REFERENCES:
patent: 2008/0258169 (2008-10-01), Masuko
patent: 2009/0231833 (2009-09-01), Miki et al.

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