Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2011-06-21
2011-06-21
Nguyen, Dao H (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C257S099000
Reexamination Certificate
active
07964420
ABSTRACT:
An LED chip package structure includes a conductive unit, a first package unit, an ESD unit, a second package unit, a light-emitting unit and a second package unit. The conductive unit has two conductive pins adjacent to each other which form a concave space between each other. The first package unit encloses one part of each conductive pin in order to form a receiving space communicating with the concave space and to expose an end side of each conductive pin. The ESD unit is received in the concave space and electrically connected between the two conductive pins. The second package unit is received in the concave space in order to cover the ESD unit. The light-emitting unit is received in the receiving space and electrically connected between the two conductive pins. The third package unit is received in the receiving space in order to cover the light-emitting unit.
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patent: 2006/0267040 (2006-11-01), Baek et al.
patent: 2007/0018191 (2007-01-01), Roh et al.
Chen Jia-Wen
Wang Bily
Yang Ping-Chou
Harvatek Corporation
Nguyen Dao H
Nguyen Tram H
Rosenberg , Klein & Lee
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