Led chip mounting structure and image reader having same

Facsimile and static presentation processing – Facsimile – Picture signal generator

Reexamination Certificate

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Details

C358S482000, C358S483000, C257S431000

Reexamination Certificate

active

07551329

ABSTRACT:
An LED chip mounting structure provided by the present invention includes a wiring board with a mounting pad an LED chip with an electrode facing the mounting pad a bump disposed between the mounting pad and the electrode to electrically connect the mounting pad to the electrode and an adhesive member for fixing the LED chip to the wiring board.

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Japanese Office Action from the corresponding JP 2002-180076, mailed Apr. 17, 2007.
Japanese Office Action for the corresponding JP application 2002-180076, mailed Nov. 21, 2006.
Japanese Office Action for corresponding application 2002-180076, mailed Aug. 29, 2006.

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