Active solid-state devices (e.g. – transistors – solid-state diode – Organic semiconductor material
Reexamination Certificate
2005-04-26
2008-12-09
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Organic semiconductor material
C257S094000, C257S103000
Reexamination Certificate
active
07462861
ABSTRACT:
An LED chip includes a bond pad suitable for thermosonic or thermocompression bonding such as Sn, AuSn or other metals. The physical dimensions of the bond pad are selected to discourage or prevent solder squeeze-out during thermocompression or thermosonic bonding with or without flux. In some embodiments, an AuSn bond pad is designed to accept 30 g to 70 g of force or more without squeeze-out.
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Edmond John Adam
Slater, Jr. David Beardsley
Cree Inc.
Rao Steven H
Summa, Additon & Ashe, P.A.
Weiss Howard
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