LED-based light source having improved thermal dissipation

Details LED-based light source having improved thermal dissipation LED-based light source having improved thermal dissipation

2011-04-12

2011-04-12

Pham, Hoai v (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S678000, C257SE23031

Reexamination Certificate

active

07923831

ABSTRACT:
A light source having a plurality of dies mounted on leads that are partially enclosed in a plastic body is disclosed. Each die is powered by first and second contacts. One contact is connected to the lead on which the die is mounted. Light from the LED exits the die through the top surface. Each lead includes a layer of metal of substantially constant thickness. The layer includes a boundary, a die mounting region within the boundary and a heat transfer region within the boundary. The boundary increases in a dimension perpendicular to a line connecting the die mounting region and the heat transfer region. The leads are arranged such that the die mounting regions are proximate to a first point and oriented such that the lines radiate from the first point. The light source can be manufactured using conventional lead frame techniques.

REFERENCES:
patent: 6634771 (2003-10-01), Cao
patent: 2005/0213334 (2005-09-01), Lee et al.

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