Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure
Reexamination Certificate
2006-11-21
2006-11-21
Abraham, Fetsum (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
C257S081000, C257S100000
Reexamination Certificate
active
07138659
ABSTRACT:
A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.
REFERENCES:
patent: 4077144 (1978-03-01), Smits
patent: 4241277 (1980-12-01), Hintze et al.
patent: 4394600 (1983-07-01), Flannagan
patent: 4937654 (1990-06-01), Hirabayashi
patent: 5059373 (1991-10-01), Hirabayashi
patent: 5471371 (1995-11-01), Koppolu et al.
patent: 5478778 (1995-12-01), Tanisawa
patent: 5550721 (1996-08-01), Rapisarda
patent: 5632551 (1997-05-01), Roney et al.
patent: 5719444 (1998-02-01), Tilton et al.
patent: 5746497 (1998-05-01), Machida
patent: 5806965 (1998-09-01), Deese
patent: 5857767 (1999-01-01), Hochstein
patent: 6116759 (2000-09-01), Smith
patent: 6175342 (2001-01-01), Nicholson et al.
patent: 6238056 (2001-05-01), Rapisarda
patent: 6283613 (2001-09-01), Schaffer
patent: 6390643 (2002-05-01), Knight
patent: 6402347 (2002-06-01), Maas et al.
patent: 6480389 (2002-11-01), Shie et al.
patent: 6652127 (2003-11-01), Tarabula
patent: 6813853 (2004-11-01), Tucker
patent: 6831305 (2004-12-01), Yasukawa et al.
patent: 2002/0074557 (2002-06-01), Uda et al.
patent: 2003/0048912 (2003-03-01), Reich
patent: 2003/0063463 (2003-04-01), Sloan et al.
patent: 2003/0072153 (2003-04-01), Nobuyuki et al.
patent: 2003/0076033 (2003-04-01), Jiahn-Chang
patent: 2003/0098460 (2003-05-01), Yasukawa et al.
patent: 2003/0112627 (2003-06-01), Deese
patent: 2004/0125515 (2004-07-01), Popovich
patent: 2005/0018424 (2005-01-01), Popovich
patent: 2005/0178034 (2005-08-01), Schubert et al.
patent: 377352 (1990-07-01), None
patent: 57095682 (1982-06-01), None
patent: 02278282 (1990-11-01), None
patent: 04290478 (1992-10-01), None
patent: 05072978 (1993-03-01), None
patent: 05074975 (1993-03-01), None
patent: 05134615 (1993-05-01), None
patent: 06151915 (1994-05-01), None
patent: 06314863 (1994-11-01), None
patent: 2002/244591 (2002-08-01), None
patent: 2003223121 (2003-08-01), None
patent: WO 2004/019657 (2004-03-01), None
patent: PCT/US2005/009302 (2005-03-01), None
U.S. Appl. No. 60/405,826 filed Aug. 26, 2002.
International Search Report of PCT/US03/25913 dated Mar. 18, 2004.
Written Opinion of PCT/US03/25913 dated May 21, 2004.
Desai Nilesh Thakor
Flank Steven
Raos Robert Bogdan
Abraham Fetsum
OnScreen Technologies, Inc.
LandOfFree
LED assembly with vented circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with LED assembly with vented circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and LED assembly with vented circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3641260