Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having substrate registration feature
Patent
1996-12-17
1999-08-24
Bowers, Charles
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Having substrate registration feature
438 22, 257797, H01L 2176
Patent
active
059435860
ABSTRACT:
An alignment mark on a light-emitting diode (LED) array chip is formed together with the light-emitting areas of the diodes in the array, by use of a combined mask having a first part and a second part. An impurity is introduced through windows in the first part to form the light-emitting areas. Next the windows are covered with an etching resist, and the chip substrate is etched to create a topographic relief feature defined by the second part of the mask. This topographic relief feature is used as an alignment mark. When LED array chips having these alignment marks are mounted on a supporting surface, they are aligned by recognizing patterns of light reflected from the topographic relief, thereby detecting the positions of the alignment marks.
REFERENCES:
patent: 5042709 (1991-08-01), Cina et al.
patent: 5173759 (1992-12-01), Murano
patent: 5554251 (1996-09-01), Watanabe et al.
patent: 5606181 (1997-02-01), Sukama et al.
patent: 5679588 (1997-10-01), Choi et al.
Koizumi Masumi
Nakamura Yukio
Nobori Masaharu
Yamanaka Aya
Bowers Charles
Frank Robert J.
OKI Electric Industry Co., Ltd.
Sulsky Martin
Voorhees Catherine M.
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