LED array

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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Details

C438S028000, C438S033000, C438S110000, C438S128000

Reexamination Certificate

active

07811842

ABSTRACT:
Methods for fabricating light-emitting diode (LED) array structures comprising multiple vertical LED stacks coupled to a single metal substrate is provided. The LED array structure may comprise two, three, four, or more LED stacks arranged in any configuration. Each of the LED stacks may have an individual external connection to make a common anode array since the p-doped regions of the LED stacks are all coupled to the metal substrate, or some to all of the n-doped regions of the LED stacks may be electrically connected to create a parallel LED array. Such LED arrays may offer better heat conduction and improved matching of LED characteristics (e.g., forward voltage and emission wavelength) between the individual LED stacks compared to conventional LED arrays.

REFERENCES:
patent: 2003/0082890 (2003-05-01), Eldridge et al.
patent: 2005/0073846 (2005-04-01), Takine
patent: 2005/0110036 (2005-05-01), Park et al.
patent: 2006/0023451 (2006-02-01), Han et al.
patent: 2006/0044803 (2006-03-01), Edwards
patent: 2006/0154390 (2006-07-01), Tran et al.
patent: 2007/0228404 (2007-10-01), Tran et al.

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