Leaved thermal cooling module

Details Leaved thermal cooling module Leaved thermal cooling module

1980-01-21

1981-04-28

Richter, Sheldon J.

Heat exchange

With retainer for removable article

Including liquid heat exchange medium

165185, 357 82, 361386, H01L 2336, H01L 2344

Patent

active

042639654

ABSTRACT:
A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module. The provision of thin leaf shaped members each having a relatively long thin planar surface in thermal contact with a planar surface of the chip to be cooled, said thin leaf shaped members each being contained within a module cover, each of said thin leaf shaped members being spring biased in thermal contact with said planar surface of said chip, whereby the relatively long thin planar surface of each thin leaf shaped member is maintained in intimate thermal contact with the planar surface of the chip.

REFERENCES:
patent: 3212564 (1965-10-01), Passman et al.
patent: 3449172 (1969-06-01), Dingwall
patent: 3551758 (1970-12-01), Ferree
patent: 3741292 (1973-06-01), Aakalu et al.
patent: 3993123 (1976-11-01), Chu et al.
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4156458 (1979-05-01), Chu et al.
Conduction Cooling, Chu, IBM Tech. Disclosure Bull., vol. 21, No. 2, Jul. 1978, pp. 752-753.
Serrated Pistons for Improved Module Cooling, Oktay et al., IBM Tech. Disclosure Bull., vol. 21, No. 5, Oct. 1978, pp. 1858-1859.
Brush-tipped Piston for Thermal Conduction, Dessauer et al., IBM Tech. Disclosure Bull., vol. 21, No. 5, Oct. 1978, p. 1857, Search Files.
Module Thermal Cap for Semiconductor Chip Package, Meeker et al., IBM Tech. Disclosure Bull., vol. 20, No. 7, Dec. 1977, pp. 2699-2700, search files.

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