Image analysis – Applications – Manufacturing or product inspection
Patent
1994-02-04
1997-04-15
Couso, Yon J.
Image analysis
Applications
Manufacturing or product inspection
382149, 348126, G06K 900
Patent
active
056218117
ABSTRACT:
A method and apparatus which incorporate self learning techniques for the detection of solder defects and for statistical process control of solding operations on printed circuit board assemblies (PCBA) are disclosed. The invention includes learning techniques which are used during the inspection of cross-sectional X-ray images of solder joints. These learning techniques improve measurement accuracy by accounting for localized shading effects, which can occur when inspecting double-sided printed circuit board assemblies. Two specific examples are discussed. The first is a method for detection of solder short defects. The second method utilizes learning to improve the accuracy of statistical process control (SPC) measurements.
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Adams John A.
Baker Bruce D.
Corey Robert L.
Roder Paul A.
Ross Edward W.
Couso Yon J.
Hewlett-Packard Co.
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