Leads under chip in conventional IC package

Details Leads under chip in conventional IC package Leads under chip in conventional IC package

1996-12-30

1999-05-25

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

H01L 2160

Patent

active

059077697

ABSTRACT:
A process for manufacturing a semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality lead fingers of the lead frame located below the semiconductor device in a substantially horizontal plane and another portion of the plurality of lead fingers of the lead frame located substantially in the same horizontal plane as the active surface of the semiconductor device. Both plurality of lead finger of the lead frame having their ends being located substantially adjacent the peripheral sides of the semiconductor device, rather than at the ends thereof.

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