Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1991-09-26
1993-06-08
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257678, H01L 2302
Patent
active
052181685
ABSTRACT:
An improved system for the production of semiconductor devices is described. The invention incorporates conventional, known die attach technology and tape automated bonding technology with known technology for the selective placement of electroconductive material upon a polymer film, which is then enclosed in the same film, to create a system whereby typical integrated circuit die can be simultaneously attached, physically and electrically, to typical lead frames and lead fingers and other lead terminals, to produce a highly reliable integrated circuit, with low inductance between the die and the lead terminals, which may then be encapsulated and trimmed and formed, in known ways, to complete the assembled package.
REFERENCES:
patent: 3617817 (1971-11-01), Kawakatsu et al.
patent: 5012323 (1991-04-01), Farnworth
patent: 5025114 (1991-06-01), Braden
Farnworth Warren M.
Mitchell Steven L.
Duffy Wayne E.
Ledynh Bot L.
Micro)n Technology, Inc.
Picard Leo P.
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