Leads for semiconductor chip assembly and method

Details Leads for semiconductor chip assembly and method Leads for semiconductor chip assembly and method

1992-11-24

1994-05-03

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437206, 437211, 437217, 437220, H01L 2160

Patent

active

053087976

ABSTRACT:
A semiconductor device is formed without using a leadframe. A semiconductor device is formed in one area of a semiconductor chip and a second area includes conductors to which lead wires are bonded. The lead wires are used for mounting the semiconductor device.

REFERENCES:
patent: 4994411 (1991-02-01), Naito et al.
patent: 5008997 (1991-04-01), Phy
patent: 5066614 (1991-11-01), Dunaway
patent: 5079190 (1992-01-01), Mihara
patent: 5086018 (1992-02-01), Conru et al.
patent: 5095361 (1992-03-01), Iwata

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