Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-11-01
1995-01-03
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 163, 174 35R, 361715, 361730, 361814, 361816, 439 66, H05K 720
Patent
active
053791851
ABSTRACT:
A leadless surface mountable assembly (100) includes a heat dissipating cover (110), a substrate (120), a heat generating semiconductor device (130), and a spacer (140). The substrate (120) is mounted on the interior surface (115) of the cover (110). The heat generating semiconductor device (130) is thermally coupled to the cover (110) and electrically coupled to the substrate (120). The spacer (140) has an interface portion (147) which provides an electrical interface to the substrate (120). Electrical contacts (144) are disposed on the interface portion (147) of the spacer (140) and are electrically coupled to the substrate (120) through electrical conductors (145) within the spacer (140).
REFERENCES:
patent: 5061191 (1991-10-01), Casciotti et al.
patent: 5123849 (1992-06-01), Deak et al.
patent: 5155661 (1992-10-01), Nagesh et al.
patent: 5229917 (1993-07-01), Harris et al.
Buchoff, "Solving High Density Electronic Problems With Elastomeric Connectors", Nepcon Technical Program Conference Anaheim, Mar. 1990, pp. 3-7.
Motorola, Inc., RF Products Selector Guide and Cross Reference Manual, "RF Amplifiers" pp. 60-16, Mar. 1993.
Griffin Curtis
Siomkos John R.
Tan Geroncio
Fuller Andrew S.
Motorola Inc.
Thompson Gregory D.
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