Leadless semiconductor package

Details Leadless semiconductor package Leadless semiconductor package

2007-03-20

2007-03-20

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Reexamination Certificate

active

10876458

ABSTRACT:
A leadless semiconductor package mainly comprises a leadless lead-frame, a chip, a silver paste and a plurality of electrically conductive wires. The lead frame includes a chip paddle and a plurality of leads surrounding the chip paddle wherein the chip paddle has a cavity serving as a chip disposal area and a grounding area surrounding the cavity, and at least there is one recession formed on the grounding area. Besides, the chip is disposed in the cavity so that the back surface of the chip faces the chip paddle and attached onto the chip paddle via the silver paste. Moreover, the chip is electrically connected to the leads. As mentioned above, the grounding area has at least one recession formed therein, so the contact area of the leadless lead-frame with the encapsulation will be increased to enhance the attachment of the encapsulation to the leadless lead-frame.

REFERENCES:
patent: 6713849 (2004-03-01), Hasebe et al.
patent: 2002/0027297 (2002-03-01), Ikenaga et al.
patent: 2004/0041242 (2004-03-01), Joshi

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