Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1992-11-16
1993-08-31
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257787, 257693, 257774, 257786, 174 522, 361728, 361736, 361768, 361777, H01L 2302, H01L 2328, H05K 700
Patent
active
052411338
ABSTRACT:
A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 25) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).
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patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5107329 (1992-04-01), Okinaga et al.
Freyman Bruce J.
Mullen, III William B.
Urbish Glenn F.
Dorinski Dale W.
Ledynh Bot
Motorola Inc.
Picard Leo P.
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