Leadless package retaining frame

Details Leadless package retaining frame Leadless package retaining frame

1974-11-11

1976-09-21

Smith, Jr., David

Geometrical instruments

339 17CF, H05K 104

Patent

active

039821595

ABSTRACT:
A retaining frame for forming interconnections between contact pads on a flat leadless I.C. package and corresponding pads on a parallel mother board so that when the package is moved toward the mother board and into the frame, contacts in the frame are compressed and contact surfaces are biased toward and moved along the contact pads on the package and board to form positive wiped electrical connections.

REFERENCES:
patent: 3551750 (1970-12-01), Sterling
patent: 3831131 (1974-08-01), Woodcock et al.
patent: 3873173 (1975-03-01), Anhalt
patent: 3877064 (1975-04-01), Scheingold

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