Leadless package receptacle

Geometrical instruments

Patent

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Details

H05K 502

Patent

active

039514951

ABSTRACT:
A leadless package receptacle for packaging and mounting electronic devices. The receptacle retains a plurality of spring contacts for soldering to a printed circuit board in a conventional manner and disposed within the receptacle to yieldably engage the lower surface of the package. The chip carrier has a plurality of conductive areas on the lower surface thereof for engaging the spring contacts and further has edge regions cooperatively disposed with respect to locking members on the receptacle for retaining the package in the receptacle. A mounting and removal tool is also disclosed.

REFERENCES:
patent: 3391383 (1968-07-01), Antes
patent: 3409857 (1968-11-01), O'Neill et al.
patent: 3416122 (1968-12-01), Kinkaid
patent: 3700788 (1972-10-01), Spurck
patent: 3846737 (1974-11-01), Spaulding

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