Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2009-01-07
2010-10-05
Lee, Eugene (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S729000, C257S734000, C257S773000, C257S784000, C257SE23061, C257SE23141, C257SE23169, C228S180500
Reexamination Certificate
active
07808103
ABSTRACT:
Provided is a semiconductor package, and in particular a semiconductor package which is capable of electrically connecting to the outside without a lead. The leadless package includes a plurality of lower conducting layer patterns disposed separately from one another; an insulating layer pattern on the lower conducting layer patterns; a plurality of upper conducting layer patterns disposed separately from one another, on the insulating layer pattern; at least one semiconductor chip disposed on the upper conducting layer patterns; hole patterns formed through the upper conducting layer patterns and the insulating layer pattern, so that a part of the top surface of the lower conducting layer patterns are exposed; and electrical connectors electrically connecting: the at least one semiconductor chip and the upper conducting layer patterns; the upper conducting layer patterns and the lower conducting layer patterns exposed by the hole patterns; and the at least one semiconductor chip and the lower conducting layer patterns exposed by the hole patterns.
REFERENCES:
patent: 6806580 (2004-10-01), Joshi et al.
patent: 7061077 (2006-06-01), Joshi
patent: 7154186 (2006-12-01), Noquil et al.
patent: 7242076 (2007-07-01), Dolan
patent: 7268414 (2007-09-01), Choi et al.
patent: 7285849 (2007-10-01), Cruz et al.
patent: 7315077 (2008-01-01), Choi et al.
patent: 7335532 (2008-02-01), Noquil et al.
patent: 7371616 (2008-05-01), Jereza
patent: 7439613 (2008-10-01), Joshi et al.
patent: 7468548 (2008-12-01), Wu et al.
patent: 7504281 (2009-03-01), Joshi
Lee Keun-hyuk
Lim Seung-Won
Park Sung-min
Fairchild Korea Semiconductor Ltd.
Gumedzoe Peniel M
Lee Eugene
Townsend and Townsend / and Crew LLP
LandOfFree
Leadless package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Leadless package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadless package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4213887