Leadless integrated circuit packaging system and method of...

Details Leadless integrated circuit packaging system and method of... Leadless integrated circuit packaging system and method of...

2011-08-09

2011-08-09

Sandvik, Benjamin P (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C438S106000, C438S111000, C257S676000, C257S691000, C257S697000, C257SE23020, C257SE23031, C257SE23045, C257SE23060, C257SE23061

Reexamination Certificate

active

07994629

ABSTRACT:
A method of manufacture of a leadless integrated circuit packaging system includes: providing a substrate; patterning a die attach pad on the substrate; forming a tiered plated pad array around the die attach pad; mounting an integrated circuit die on the die attach pad; coupling an electrical interconnect between the integrated circuit die and the tiered plated pad array; forming a molded package body on the integrated circuit die, the electrical interconnects, and the tiered plated pad array; and exposing a contact pad layer by removing the substrate.

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patent: 2005/0062172 (2005-03-01), Low et al.
patent: 2007/0007665 (2007-01-01), Clevenger et al.

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