Communications – electrical: acoustic wave systems and devices – Borehole testing
Patent
1992-11-03
1996-07-09
Picard, Leo P.
Communications, electrical: acoustic wave systems and devices
Borehole testing
361760, 361771, 361807, 257686, 257787, 174 524, 174260, H05K 710
Patent
active
055351018
ABSTRACT:
A semiconductor device package comprises an integrated circuit chip (10), a substrate (16), an encapsulant (30), and an organic coupling agent or underfill material (12) disposed between the integrated circuit chip and the first side of the substrate. The chip has a plurality of interconnection pads (14) disposed on an active surface of the chip at some minimum spacing "X." Each of the interconnect pads also has electrically conducting bumps (26) on them. The substrate has a circuit pattern (20) on a first side and an array of solder pads (23) spaced a certain distance apart on an opposite side of the substrate. The distance between these pads is greater than the minimum distance (X) between the interconnect pads on the IC. The circuit pattern is electrically connected to the array of solder pads by plated through holes (22). The length and width of the circuit carrying substrate is substantially greater than the length and width of the integrated circuit chip. The chip is mounted face down to the substrate with the electrically connecting bumps, such that at least some of the plated through holes in the substrate are covered by the chip. The polymeric encapsulant (30) covers the entire chip and substantially all of the first side of the substrate, providing a sealed package.
REFERENCES:
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4864470 (1989-09-01), Nishio
patent: 4931345 (1990-06-01), Bottger et al.
patent: 5107325 (1992-04-01), Nakayoshi
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5378869 (1995-01-01), Marrs et al.
Banerji Kingshuk
Juskey Frank J.
Miles Barry M.
Dorinski Dale W.
Motorola Inc.
Picard Leo P.
Whang Y.
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