Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Patent
1987-11-02
1989-06-13
McGlynn, Joseph H.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
439482, 439851, 439 66, H01R 909
Patent
active
048388017
ABSTRACT:
A leadless component socket comprises a socket body of electrically insulative material and planar, substantially parallel, top and bottom surfaces, and a plurality of openings between the surfaces in an array to provide an intended contact pattern. A two-piece spring contact assembly is retained in respective openings, with one element retained within the opening and having an outwardly extending lead for soldering or other connection to a circuit board on which the socket is mounted, and the other element extending above the upper socket surface in a position to engage the confronting terminals of a leadless component or device, such as a leadless chip carrier.
REFERENCES:
patent: 4083623 (1978-04-01), Lynch
patent: 4636026 (1987-01-01), Cooney et al.
patent: 4645278 (1987-02-01), Yevak, Jr. et al.
patent: 4686465 (1987-08-01), Kruger
patent: 4716365 (1987-12-01), Pool
patent: 4718166 (1988-01-01), DeFilippis et al.
Bertoglio Guido
Boyle Michael C.
Cooney James S.
Walkup William B.
Augat Inc.
Bradley P. Austin
McGlynn Joseph H.
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