Leadless chip placement machine for printed circuit boards

Metal working – Means to assemble or disassemble – With means to test work or product

Patent

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Details

29740, 29759, 295646, 156378, 156379, 156562, B23P 2100

Patent

active

044584121

ABSTRACT:
Described is a machine for pre-gluing raw circuit surfaces of printed circuit boards (P.C. boards) at an adhesive station and properly positioning the P.C. boards at a placement station for placement of leadless electronic components (chips) onto the adhesive. A carousel provides program preselected vertical supply of taped components to a feeder assembly which feeds individual chips onto a nozzle of a turret-type vacuum head at a pick-up station. The turret-type head has four nozzles spaced 90.degree. apart about the central axis of the head. As the turret is rotated, a chip is transported by a nozzle, sequentially, from the pick-up station to a centering and testing station, a centering and orienting station, and a placement station. Located between the testing and orienting stations is a chip removal station for ejecting defective or inverted chips. Sensors are located at the adhesive and placement stations to detect defective P.C. boards so that they may be bypassed. A controller, such as a digital computer, provides additional monitoring and controls the operation of the machine.

REFERENCES:
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patent: 3499203 (1970-03-01), Clark et al.
patent: 3499204 (1970-03-01), Drop
patent: 3946931 (1976-03-01), Bahnck et al.
patent: 4054988 (1977-10-01), Masuzima et al.
patent: 4177549 (1979-12-01), Mori et al.
patent: 4327484 (1982-05-01), Asai et al.
Hoebener, K. G., "Multiple Size Chip Pickup, Orientation and Placement Station," from IBM Technical Disclosure Bulletin, vol. 22, No. 7, Dec. 1979, pp. 2757-2761.
Godat, J. J. L., "Interchanging Articles", from IBM Technical Disclosure Bulletin, vol. 8, No. 5, Oct. 1965, pp. 776, 777.

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