Leadless chip placement machine for printed circuit boards

Details Leadless chip placement machine for printed circuit boards Leadless chip placement machine for printed circuit boards

1984-04-25

1985-07-09

Briggs, William R.

Metal working

Plural diverse manufacturing apparatus including means for...

Separate tool stations for selective or successive operation...

295662, H05K 330

Patent

active

045273243

ABSTRACT:
Described is a machine for pre-gluing raw circuit surfaces of printed circuit boards (P.C. boards) at an adhesive station and properly positioning the P.C. boards at a placement station for placement of leadless electronic components (chips) onto the adhesive. A carousel provides program preselected vertical supply of taped components to a feeder assembly which feeds individual chips onto a nozzle of a turret-type vacuum head at a pick-up station. The turret-type head has four nozzles spaced 90.degree. apart about the central axis of the head. As the turret is rotated, a chip is transported by a nozzle, sequentially, from the pick-up station to a centering and testing station, a centering and orienting station, and a placement station. Located between the testing and orienting stations is a chip removal station for ejecting defective or inverted chips. Sensors are located at the adhesive and placement stations to detect defective P.C. boards so that they may be bypassed. A controller, such as a digital computer, provides additional monitoring and controls the operation of the machine.

REFERENCES:
patent: 3813753 (1974-06-01), Miller
patent: 4051593 (1977-10-01), Mori et al.
patent: 4054988 (1977-10-01), Masuzima et al.
patent: 4192061 (1980-03-01), Masuzima et al.
patent: 4293999 (1981-10-01), Woodman

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