Leadless chip carriers having self-aligning mounting pads

Details Leadless chip carriers having self-aligning mounting pads Leadless chip carriers having self-aligning mounting pads

1984-05-29

1986-07-15

Grimley, Arthur T.

Electricity: electrical systems and devices

Miscellaneous

114 52FP, H05K 111

Patent

active

046009701

ABSTRACT:
A pad configuration for surface mounted components having contact pads along the periphery thereof includes a plurality of interior pads distributed in a grid with the period of interior pads being three quarters of the period of the peripheral pads multiplied by an integer greater than 1.

REFERENCES:
patent: 3344316 (1967-09-01), Stelmak
patent: 3869787 (1975-03-01), Umbaugh
patent: 4056681 (1977-11-01), Cook, Jr.
patent: 4417296 (1983-11-01), Schelhorn
patent: 4458297 (1984-07-01), Stopper et al.
patent: 4475007 (1984-10-01), Ohno
patent: 4489365 (1984-12-01), Daberkoe
patent: 4509096 (1985-04-01), Baldwin et al.
"Guidelines for Surface Mounting and Interconnecting Chip Carriers", by: IPC, The Institute for Interconnecting and Packaging Electronic Circuits, Evanston, Ill., Nov. 1983, p. 24.

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