Leadless chip carrier and process for fabrication of same

Details Leadless chip carrier and process for fabrication of same Leadless chip carrier and process for fabrication of same

1983-07-22

1987-09-29

Sikes, William L.

357 80, H01L 2302

Patent

active

046972048

ABSTRACT:
A leadless chip carrier is constructed in such a manner that each of the electrode terminals is made to be recessed from the insulation layer of the bottom surface of the carrier so as to have a difference in level between the bottom surface and at least a part of the electrode terminal. Because of such construction, when the electrode terminals are bonded to the conductors of the printed circuit board in the reflowing method, molten solder is collected in the recessed portions of the electrode terminals besides each portion of the insulation layer positioned between the electrode terminals prevents flowing of the molten solder in the recessed portion, so that strength and reliability in the bonding are remarkably improved.

REFERENCES:
patent: 4288841 (1981-09-01), Gogal
patent: 4463217 (1984-07-01), Orcutt
patent: 4554575 (1985-11-01), Lucas

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