Leadless ceramic package with improved solderabilty

Details Leadless ceramic package with improved solderabilty Leadless ceramic package with improved solderabilty

1993-02-16

1994-05-24

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205170, 205181, C25D 502

Patent

active

053146069

ABSTRACT:
A method of fabricating a leadless ceramic package having improved solderability characteristics. The ceramic packages are singulated from the package array before electroplating. This eliminates the damage which may occur to the plating layer during singulation, and permits plating of base metal exposed by singulation. Furthermore, the plating solution is not required to penetrate small-diameter castellation holes, which would often result in incomplete electroplating of the castellation surfaces.

REFERENCES:
patent: 3926746 (1975-12-01), Hargis
patent: 4681656 (1987-07-01), Byrum
patent: 4768077 (1988-08-01), Scherer

Affiliated with

Also associated with

Rating

Leadless ceramic package with improved solderabilty does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadless ceramic package with improved solderabilty, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadless ceramic package with improved solderabilty will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1970936