Leadless ceramic chip carrier printed wiring board adapter

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

174 524, 361398, 361412, H05K 114

Patent

active

048558729

ABSTRACT:
A leadless ceramic chip carrier (LCCC) is attached to an organic printed wiring board (PWB) via a Kapton.RTM. landing interface member. The LCCC terminals are soldered to conductors on the interface member whose conductors are also soldered to mating conductors on the PWB. The member is epoxied to the PWB to hold the member in place during vapor phase solder reflow of the different solder joints.

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O. R. Abolafia, Chip Interconnection Device, IBM Tech. Disc. Bull., vol. 15,#2, Jul. 1972 p. 420.
Larnerd et al., IC Package Assemblies, IBM Tech. Dis. Bull., vol. 21,#5, Oct. 1978, pp. 1817 and 18.
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Peter M. Hall, "Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards," IEEE Transactions On Components, Hybrids, And Manufacturing Technology, vol. CHMT-7, No. 4, Dec. 1984, pp. 314-327.
Larry Hayes, "Polymer Multilayers for Chip Carrier Applications," PC FAB, Dec. 1984, pp. 49-50, 55-58.

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