Metal working – Piezoelectric device making
Patent
1999-01-25
2000-08-22
Gerrity, Stephen F.
Metal working
Piezoelectric device making
29740, 29832, 29833, 29840, 29841, 174524, 174 523, 174 524, 257686, 257693, 257700, 257704, H04R 1700
Patent
active
061052264
ABSTRACT:
A leadless ceramic chip carrier useful in surface mounting of SAW devices includes electrically conductive vias and metalization between input and output bond pads for improved crosstalk suppression between input and output device connections. A protrusion extending from a top layer of a multilayer ceramic carrier provides additional electrical contact to a package seal brazed thereto. The vias are positioned between input and output bond pads and connect the metalized protrusion to package ground pads through contact with multiple metalized layers of the package for enhancing the electrical connection between the package Kovar seal ring and customer accessed ground pads. For further suppression of crosstalk, bond pads within the package for connection to the SAW device are spaced at a greater distance from each other than their corresponding pads on the package bottom surface thus maintaining an optimum spacing for package connection to printed circuit board pads for minimizing thermal mismatch effects.
REFERENCES:
patent: 3520054 (1970-07-01), Pensack et al.
patent: 3835531 (1974-09-01), Luttner
patent: 3872331 (1975-03-01), Falco
patent: 4417392 (1983-11-01), Ibrahim
patent: 4551747 (1985-11-01), Gilbert et al.
patent: 4608592 (1986-08-01), Miyamoto
patent: 4658332 (1987-04-01), Baker
patent: 4847136 (1989-07-01), Lo
patent: 5135890 (1992-08-01), Temple
patent: 5155905 (1992-10-01), Miller
patent: 5177326 (1993-01-01), Goldhammer
patent: 5369551 (1994-11-01), Gore
patent: 5418688 (1995-05-01), Hertz
patent: 5455385 (1995-10-01), Newton et al.
patent: 5461196 (1995-10-01), Virga et al.
patent: 5477933 (1995-12-01), Nguyen
Low-Cost Surface Mount Packaging for SAWs, J. Gore, B. Horine, J. Phillips, R. Hoffman and J. Dodge, Oct. 1992, 1992 Ultrasonic Symposium Proceedings, vol. 1 of 2, pp. 129-138.
Surface Moung Package Catalog, Kyocera Corporation, Corporate Semiconductor Parts Division, 1991.
Mulitlayer Ceramics Catalog, Kyocera Corporation, Corporate Semiconductor Parts Division, 1992.
Brown Roy B.
Gopani Sunder
Gore John G.
Tolar Neal J.
Gerrity Stephen F.
Kim Paul D.
Sawtek Inc.
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