Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1996-05-16
1999-01-26
Sough, Hyung-Sub
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
174261, 257686, 257693, 257700, 257704, 361735, 361790, 361794, H01L 2302
Patent
active
058640924
ABSTRACT:
A leadless ceramic chip carrier useful in surface mounting of SAW devices includes electrically conductive vias and metalization between input and output bond pads for improved crosstalk suppression between input and output device connections. A protrusion extending from a top layer of a multilayer ceramic carrier provides additional electrical contact to a package seal brazed thereto. The vias are positioned between input and output bond pads and connect the metalized protrusion to package ground pads through contact with multiple metalized layers of the package for enhancing the electrical connection between the package Kovar seal ring and customer accessed ground pads. For further suppression of crosstalk, bond pads within the package for connection to the SAW device are spaced at a greater distance from each other than their corresponding pads on the package bottom surface thus maintaining an optimum spacing for package connection to printed circuit board pads for minimizing thermal mismatch effects.
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Surface Mount Package Catalog, Kyocera Corporation, Corporate Semiconductor Parts Division, 1991.
Multilayer Ceramics Catalog, Kyocera Corporation, Corporate Semiconductor Parts Division, 1992.
Brown Roy B.
Gopani Sunder
Gore John G.
Tolar Neal J.
Sawtek Inc.
Sough Hyung-Sub
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