Leadframe system with multi-tier leads

Details Leadframe system with multi-tier leads Leadframe system with multi-tier leads

1989-08-03

1991-01-22

Hille, Rolf

H01L 2348, H01L 2354

Patent

active

049874730

ABSTRACT:
The leadframe of this invention includes a die attach pad and leads with lead tips in the vicinity of the pad. Alternate lead tips have been bent upwards into one plane and the remaining lead tips are bent downwards into a different plane. This design enables a denser packing of lead tips without fear of electrical shorts than the conventional design where the lead tips are in the same plane.

REFERENCES:
patent: 4323293 (1982-04-01), DeRouen et al.
patent: 4766478 (1988-08-01), Dennis
patent: 4796078 (1989-01-01), Phelps, Jr. et al.

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