Leadframe structure and process for packaging intergrated circui

Details Leadframe structure and process for packaging intergrated circui Leadframe structure and process for packaging intergrated circui

1996-11-05

1999-08-17

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257671, 438127, H01L 23495

Patent

active

059397756

ABSTRACT:
An improved leadframe structure and an improved IC package and process using such structure are disclosed. The improved leadframe structure eliminates the dambar commonly found on leadframes for use in plastic packages. A polymer structure is formed and employed primarily to act as a barrier to flashing during the epoxy encapsulation process and secondarily to provide support for the leads. The polymer structure remains a permanent part of the IC package following molding. An improved IC packaging process using the improved leadframe design eliminates common debar, dejunk and deflash operations, resulting in reduced capital costs and higher yields.

REFERENCES:
patent: 3778887 (1973-12-01), Suzuki et al.
patent: 4204317 (1980-05-01), Winn
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4721994 (1988-01-01), Mine et al.
patent: 4754317 (1988-06-01), Comstock et al.
patent: 4774635 (1988-09-01), Greenberg et al.
patent: 4778146 (1988-10-01), Olla et al.
patent: 4796080 (1989-01-01), Phy
patent: 4801997 (1989-01-01), Ono et al.
patent: 4883774 (1989-11-01), Djennas et al.
patent: 4890157 (1989-12-01), Wilson
patent: 4899207 (1990-02-01), Hallowell et al.
patent: 4903401 (1990-02-01), Webb
patent: 4977442 (1990-12-01), Suzuki et al.
patent: 5122858 (1992-06-01), Mahulikar et al.
patent: 5147210 (1992-09-01), Patterson et al.
patent: 5177591 (1993-01-01), Emanuel
patent: 5185653 (1993-02-01), Switky et al.
patent: 5202577 (1993-04-01), Ichigi et al.
patent: 5208481 (1993-05-01), Kurita et al.
patent: 5213748 (1993-05-01), Biswas et al.
patent: 5221812 (1993-06-01), Long
patent: 5223738 (1993-06-01), Okada
patent: 5225897 (1993-07-01), Reifel et al.
patent: 5231755 (1993-08-01), Emanuel
patent: 5239131 (1993-08-01), Hoffman et al.
patent: 5245214 (1993-09-01), Simpson
patent: 5270262 (1993-12-01), Switky et al.
patent: 5271148 (1993-12-01), Desrochers et al.
patent: 5285104 (1994-02-01), Kondo et al.
patent: 5286999 (1994-02-01), Chiu
patent: 5294828 (1994-03-01), Okumura
patent: 5304738 (1994-04-01), Long
patent: 5309027 (1994-05-01), Letterman, Jr.
patent: 5309322 (1994-05-01), Wagner et al.
patent: 5313102 (1994-05-01), Lim et al.
patent: 5328552 (1994-07-01), Benzoni
patent: 5329159 (1994-07-01), Lin
patent: 5336272 (1994-08-01), Tsutsumi et al.
patent: 5338899 (1994-08-01), Gainey
patent: 5339518 (1994-08-01), Tran
patent: 5340771 (1994-08-01), Rostoker
patent: 5343072 (1994-08-01), Imai et al.
patent: 5354422 (1994-10-01), Kato et al.
patent: 5355018 (1994-10-01), Fierken
patent: 5359225 (1994-10-01), Haley
patent: 5367191 (1994-11-01), Ebihara
patent: 5378656 (1995-01-01), Kajihara et al.
patent: 5378657 (1995-01-01), Lin
patent: 5384286 (1995-01-01), Hirai
patent: 5389577 (1995-02-01), McClure
patent: 5391439 (1995-02-01), Tomita et al.
patent: 5403784 (1995-04-01), Hashemi et al.
patent: 5403785 (1995-04-01), Arai et al.
patent: 5437915 (1995-08-01), Nishimura et al.
patent: 5438021 (1995-08-01), Tagawa et al.
patent: 5445995 (1995-08-01), Casati et al.
patent: 5451812 (1995-09-01), Gomi
patent: 5455745 (1995-10-01), Weiler et al.
patent: 5457341 (1995-10-01), West
patent: 5466968 (1995-11-01), Okumura et al.
patent: 5471097 (1995-11-01), Shibata
patent: 5479050 (1995-12-01), Pritchard et al.
patent: 5486722 (1996-01-01), Sato et al.
patent: 5541447 (1996-07-01), Maejima et al.
patent: 5559364 (1996-09-01), Hojyo
patent: 5637914 (1997-06-01), Tanaka et al.
patent: 5659198 (1997-08-01), Okutomo et al.

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