Leadframe strip for semiconductor packages and method

Details Leadframe strip for semiconductor packages and method Leadframe strip for semiconductor packages and method

1992-10-13

1994-05-03

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 257675, 29844, 361761, 361778, H05K 720

Patent

active

053093224

ABSTRACT:
A substantially planar insulating sheet of high temperature printed circuit board material (11) is used to form a leadframe strip (18, 19, 21) for a semiconductor package (20). The leadframe strip (18, 19, 21) includes a die attach opening (12) through the insulating sheet (11). A plurality of metallized areas (13, 22, 23) on the insulating sheet (11) form bonding pads (13) and package leads (22). Conductive holes (14) electrically connect the bonding pads (13) and the package leads (22).

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