Leadframe silver bleed elimination

Details Leadframe silver bleed elimination Leadframe silver bleed elimination

1989-04-03

1990-02-27

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 524, 204 15, 357 69, 357 70, H01R 4300

Patent

active

049034014

ABSTRACT:
A method of making a leadframe useful in packaging semiconductor devices eliminates silver bleed between adjacent leads of the leadframe. This is accomplished by leaving excess leadframe material along the edges of the leads prior to silver plating the flag area and the portion of the leads adjacent to the flag area. After the plating operation, this excess leadframe material is removed thereby leaving silver free leads which will be exposed outside of a resulting encapsulated semiconductor package.

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