Leadframe, semiconductor integrated circuit device using the sam

Details Leadframe, semiconductor integrated circuit device using the sam Leadframe, semiconductor integrated circuit device using the sam

1993-03-29

1995-01-03

Thomas, Tom

Fishing, trapping, and vermin destroying

437209, 437211, 437214, 437220, H01L 2160

Patent

active

053786564

ABSTRACT:
In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.

REFERENCES:
patent: 4534105 (1985-08-01), Reusch
patent: 4829362 (1989-05-01), Tran et al.
patent: 4835120 (1989-05-01), Mallik et al.
patent: 4868635 (1989-09-01), Frechette et al.
patent: 5083186 (1992-01-01), Okada et al.
patent: 5177032 (1993-01-01), Fogal et al.
patent: 5256598 (1993-10-01), Farnworth et al.
"Nikkei Microdevices, December, 1987", pp. 76-78 (with English language translation).

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