Leadframe package for light emitting diode device

Details Leadframe package for light emitting diode device Leadframe package for light emitting diode device

2009-03-10

2011-11-15

Sanvik, Benjamin (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S079000, C257S081000, C257S088000, C257S098000, C257S687000, C257S712000, C257SE23007, C257SE23011, C257SE23104, C438S026000, C438S027000

Reexamination Certificate

active

08058667

ABSTRACT:
An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.

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patent: 2009/0134408 (2009-05-01), Park et al.
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USPTO OA mailed Aug. 23, 2010 in connection with U.S. Appl. No. 12/381,409.

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