Leadframe matrix for a surface mount package

Details Leadframe matrix for a surface mount package Leadframe matrix for a surface mount package

2001-06-08

2002-11-05

Shooman, Ted (Department: 2912)

Equipment for production, distribution, or transformation of ene

Distribution, modification or control

Semiconductor, transistor or integrated circuit

CD13S184000

Design Patent

active

D0465207

CLAIM:
The ornamental design for leadframe matrix for a surface mount package, as shown and described.

REFERENCES:
patent: 4118859 (1978-10-01), Busler
patent: 4234666 (1980-11-01), Gursky
patent: 4633582 (1987-01-01), Ching et al.
patent: 4809054 (1989-02-01), Waldner
patent: 4818960 (1989-04-01), Satoh et al.
patent: 4852250 (1989-08-01), Andrews
patent: 4865193 (1989-09-01), Shimamoto et al.
patent: 5115299 (1992-05-01), Wright
patent: 5900582 (1999-05-01), Tomita et al.
patent: 6016918 (2000-01-01), Ziberna

Affiliated with

Also associated with

Rating

Leadframe matrix for a surface mount package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadframe matrix for a surface mount package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadframe matrix for a surface mount package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2933465