Leadframe including frame-cutting slit for lead-on-chip (LOC) se

Details Leadframe including frame-cutting slit for lead-on-chip (LOC) se Leadframe including frame-cutting slit for lead-on-chip (LOC) se

1995-07-25

1998-06-09

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 524, 257676, 257666, 257787, H01L 2302

Patent

active

057638292

ABSTRACT:
A high-reliability semiconductor device and a method of producing the device. Absorption of moisture into a semiconductor device is effectively avoided by using a hard solder material, such as common solder having no moisture absorption, for die-bonding a semiconductor chip to a die pad. Thus, in the semiconductor device in accordance with the present inventions there are no corrosion problems nor package-cracking due to absorbed moisture.

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Shukla et al., "A Critical Review of VLSI Die-Attachment In High Reliability Applications", Solid State Technology, Jul. 1985, pp. 67-74.
Hans-Jurgen Hacke, "Montage Integrierter Schaltungen", Springer-Verlag Berlin, Heidelberg New York, 1987, pp. 30-42.

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