Leadframe for supporting integrated semiconductor devices

Details Leadframe for supporting integrated semiconductor devices Leadframe for supporting integrated semiconductor devices

1995-03-31

1997-04-01

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257675, 361707, H05K 720

Patent

active

056172958

ABSTRACT:
A leadframe for electronic semiconductor devices incorporates one or two metal bars fastened to a heat dissipator by electroconductive means.
Each bar has a metallized area for the electric connection, by means of a bonding wire, with a semiconductor chip placed on the dissipator.
According to the present invention, the metallized areas are lowered in relation to the upper surface of the metal bar, so that lead frames can be stacked, during packing and transportation, directly on each other without danger of damaging the metallized areas.

REFERENCES:
patent: 3984166 (1976-10-01), Hutchison
patent: 4949220 (1990-08-01), Tashiro
patent: 5025114 (1991-06-01), Bruden
patent: 5229918 (1993-07-01), Bosca
patent: 5298464 (1994-03-01), Schlesinger
patent: 5404273 (1995-04-01), Akagawa
patent: 5410451 (1995-04-01), Hawthorne
patent: 5459639 (1995-10-01), Izumi

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