Leadframe for integrated circuit package

Details Leadframe for integrated circuit package Leadframe for integrated circuit package

1997-06-06

1999-03-30

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257766, 257762, 257750, 257477, 257736, 257698, H01L 23495, H01L 2348, H01L 2944, H01L 2328

Patent

active

058893172

ABSTRACT:
A leadframe for an IC package and a method of manufacturing the same are provided. The leadframe can be manufactured in such a manner as to provide suitable bondability, molding compound characteristic, and solderability. The leadframe includes a base structure made from a conductive material. A silver plating is formed over the base structure of the leadframe, and a palladium plating is formed over the silver plating. Depending on actual requirements, a copper layer and a nickel plating can be formed between the silver plating and the base structure of the leadframe, and a palladium
ickel plating can be found between the silver and palladium platings. Further, a gold layer can be formed over the palladium plating. The palladium plating and the palladium
ickel plating can be formed all over the leadframe or selectively formed only in the external-lead area of the leadframe. The structure of the layering of one silver layer beneath the palladium plating allows the prevention of the occurrence of pin holes in the platings so that the bondability and solderability of the leadframe can be assured.

REFERENCES:
patent: 4141029 (1979-02-01), Dromsky
patent: 5138431 (1992-08-01), Huang et al.
patent: 5384204 (1995-01-01), Yumoto et al.
patent: 5530283 (1996-06-01), Ohmi et al.
patent: 5583379 (1996-12-01), Sato et al.
patent: 5635755 (1997-06-01), Kinghorn
patent: 5650661 (1997-07-01), Mathew
patent: 5675177 (1997-10-01), Abys et al.
patent: 5684329 (1997-11-01), Serizawa

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