Leadframe for integrated circuit chips having low resistance...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Details

C257S690000, C257S692000, C257S693000, C257S773000, C257S784000, C438S123000, C361S723000, C361S813000

Reexamination Certificate

active

06838755

ABSTRACT:
A leadframe for semiconductor devices, including a region which is adapted to support a semiconductor device and a plurality of leads which are arranged so as to be directed toward the region, for mutual connection, by connecting wires connecting the leads and the semiconductor device. The leads include leads having at least two different lengths for the connection of connecting wires having different diameters.

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patent: 1-312866 (1989-12-01), None
patent: 4-51553 (1992-02-01), None
patent: 4-269856 (1992-09-01), None
patent: 11-330132 (1999-11-01), None

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