Leadframe for flash-free insert molding and method therefor

Static molds – Uniting preform with molding material – Preform supported by partition and preform projects within...

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249 93, 26427215, 26427217, 437212, B28B 7900

Patent

active

047781467

ABSTRACT:
Improved leadframe and method for the insert molding of semiconductor components or the like. A plurality of leads separated by zero-flash tab means for controlling the flash during molding are formed in a single sheet of material. The zero-flash tab means are stamped from the stock sheet and then reinserted into the area between adjacent leads. The zero-flash tab means desirably comprise a ridge section for strength and facilitating removal after the molding operation.

REFERENCES:
patent: 4109373 (1978-08-01), Fennessy et al.
patent: 4490902 (1985-01-01), Eytcheson et al.
patent: 4615857 (1986-10-01), Baird

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