Leadframe designs for integrated circuit plastic packages

Details Leadframe designs for integrated circuit plastic packages Leadframe designs for integrated circuit plastic packages

2007-05-22

2007-05-22

Tran, Long K. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S706000, C257S675000, C438S122000, C438S123000, C438S125000

Reexamination Certificate

active

10997630

ABSTRACT:
The specification describes a plastic cavity package design for high power transistor packages in which the leadframe is formed of a composite of materials. This allows the portions of the leadframe that require strength to be formed of a high strength material, e.g. steel, while the paddle portion of the leadframe is formed of a high thermal conductivity material, e.g. copper. This composite leadframe optimizes thermal and mechanical performance at low cost. In the preferred embodiment the leadframe is provided with a center cutout, where the die is attached. A copper insert is assembled in the cutout. The copper insert provides an effective heat sink, while the remainder of the leadframe provides the desired mechanical strength.

REFERENCES:
patent: 3839660 (1974-10-01), Stryker
patent: 5345106 (1994-09-01), Doering et al.
patent: 06-268134 (1994-09-01), None

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