Leadframe comprising tin plating or an intermetallic layer...

Details Leadframe comprising tin plating or an intermetallic layer... Leadframe comprising tin plating or an intermetallic layer...

2005-12-01

2008-12-09

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

C257S666000, C257SE23005, C257SE23006, C257SE23017, C257SE23041, C257SE23053, C257SE23054, C438S111000, C438S123000, C428S644000, C428S646000, C428S655000, C428S671000, C428S674000

Reexamination Certificate

active

07462926

ABSTRACT:
A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.

REFERENCES:
patent: 4055062 (1977-10-01), Martin et al.
patent: 4065625 (1977-12-01), Iwai et al.
patent: 5221428 (1993-06-01), Ohsawa et al.
patent: 5436082 (1995-07-01), Mathew
patent: 5750016 (1998-05-01), Moon
patent: 2002/0192492 (2002-12-01), Abys et al.
patent: 2004/0262719 (2004-12-01), Seki et al.
patent: 2005/0242443 (2005-11-01), Kobayashi
patent: 60-119765 (1985-06-01), None
patent: 60-143637 (1985-07-01), None
patent: 60-147148 (1985-08-01), None
patent: 2002-111188 (2002-04-01), None
English translation of Chinese Office Action for corresponding Chinese Application No. 2006-10145293.8 issued Apr. 11, 2008.

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